Amazon to acquire DuckLabs, developer of open‑source database DuckDB. The DuckDB project itself remains under MIT license via the DuckDB Foundation, including DuckLake and Quack. Financial terms undisclosed; deal expected to close soon, with DuckLabs joining AWS in early September.
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Arctera launched Arctera Community, an online hub for customers, partners and practitioners to collaborate, discuss technical topics and share knowledge. Members access product resources, expert insights and updates on regulation, governance and industry trends. The community will add more content, events and recognition features.
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DDN signed Australian sovereign AI infrastructure provider SCX.ai as a customer. SCX will use DDN’s Infinia object storage to build secure, high‑performance AI factories for Australian enterprises, government agencies and research institutions. SCX listed on the ASX on August 21 via a $40‑million IPO, with its first AI node located in Equinix SY5 Sydney data centre.
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EnterpriseDB announced new disaster‑recovery capabilities for WarehousePG. A banking customer previously needed nearly two days for full backups and restores; the new feature creates hourly restore points on cost‑optimised infrastructure without application changes. Results include 16‑minute average restore‑point replay, ~180× faster recovery, full backup time reduced from 44 hours to ~11 hours, and near‑99% drop in query‑lock time.
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Huawei and HP signed a multi‑year global cross‑patent licensing agreement covering Huawei Wi‑Fi patents for Wi‑Fi 4, 5, 6 and 7. Huawei said its Wi‑Fi contributions will remain publicly accessible for global users.
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lakeFS, provider of an AI‑ready data control plane, was named in Gartner’s July 29 “Coolest Vendor Innovations in Data Management” report. The report highlights growing interest in AI agents for automated data engineering, operational workflows and data‑lineage documentation.
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Loadbalancer appointed Joshua Turnbull as Managing Director, effective July 1, 2026. Founders Malcolm and Karen Turnbull will step back from daily operations but remain involved in long‑term strategy.
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Marvell CEO Matt Murphy said on the Q2 FY2027 earnings call that the company’s multi‑year CXL investment has become highly successful. CXL is now deployed at multiple hyperscalers for memory expansion and AI inference, with strong upward demand and new design wins secured recently.
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Nasuni is acquiring DryvIQ rather than only partnering with it. The deal adds AI‑powered content intelligence and governance to the Nasuni File Data Platform, supporting unstructured data visibility and control across more than 40 cloud and on‑premises repositories. This follows Nasuni’s acquisition of Resilio in April.
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Neridio launched new storage‑security capabilities, including custom SOC/SOAR solutions for databases and NAS, plus a purpose‑built storage‑security AI model. The company earned four new US patents in the past year and appointed Dr. Chris Moore as well as Chris Finch, former UK DBT cyber‑AI‑tech leader, as global head of partners and GTM operations.
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NVIDIA expanded NVLink Fusion with NVHBM memory technology, which moves the memory controller from the XPU die into the HBM base die. This delivers up to 30% higher memory bandwidth, 15% lower power consumption and up to 25% more compute‑die area compared with standard HBM4E. Amazon’s Annapurna Labs will be the first collaborator, integrating NVHBM into next‑generation Trainium4 chips.
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Primemas showcased CXL memory innovations at FMS 2026, including the Abaco Project with Micron for the US DOE’s Pacific Northwest National Laboratory. Abaco is a rack‑scale compute system with over 100TB of pooled CXL memory for scientific AI and HPC workloads. Primemas also unveiled the PMA14 and PMA16 CXL add‑in cards, plus SLiM, a switchless pooled‑memory architecture for KV‑cache‑heavy AI inference.
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Samsung launched USB4 portable SSDs P7 and P9. The 8TB P9 offers sequential reads up to 4,000 MB/s and writes up to 3,800 MB/s, supporting 12K direct recording for professional workflows. P9 prices start at $339.99 for 1TB, while P7 prices start at $289.99 for 1TB.
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Samsung’s Xi’an plant accounts for 40% of its total NAND output. The company is converting the Xi’an X2 line to V9 NAND, targeting monthly production of 40,000–50,000 wafers, and has approved additional investment for etching equipment.
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SemiAnalysis noted that 3D‑NAND manufacturing is shifting from tungsten to molybdenum for layers above ~300. Molybdenum reduces resistance, improves gap‑fill and eliminates fluorine‑related leakage, making it essential for high‑layer NAND.
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Media reports state SK Hynix will use Intel’s EMIB advanced packaging for next‑gen HBM chips, marking a major Intel win amid ongoing TSMC CoWoS capacity shortages.
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Synology launched the DVA7400, a 2U 12‑bay rackmount AI NVR supporting up to 100 IP cameras and 40 concurrent deep‑learning analytics tasks. It stores recordings and metadata on‑premises and supports semantic video search. Synology also released the DP5200, a 1U ActiveProtect data‑protection appliance for mid‑sized businesses and MSPs.
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Teledyne LeCroy announced the OakGate R300‑G6‑PRO and DE200‑G6‑PRO PCIe 6.0 SSD validation platforms, claiming they are the industry’s first native PCIe 6.0 solutions for end‑to‑end NVMe SSD testing.
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Toshiba released its S300 AI surveillance HDD in retail packaging, after previously offering it in bulk. The drive will be available late Q3 / early Q4 2026.
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VergeOS is now fully supported in Veeam Backup & Replication 13.1 via the Veeam Universal Hypervisor API. The plug‑in supports CBT incremental backup, cross‑platform restore, file‑level recovery and application‑item recovery.
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XCENA presented MX1, a computational CXL memory architecture, at Hot Chips 2026. MX1 supports memory expansion, SSD‑backed capacity and near‑memory computing with over 1,000 RISC‑V cores. Benchmarks showed up to 4.7× higher throughput and 18.7× better energy efficiency compared with host‑CPU processing over CXL.
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YMTC plans a Shanghai Stock Exchange IPO to raise RMB 33 billion ($5 billion) and aims to become the world’s largest NAND manufacturer by end‑2027. Counterpoint Research shows YMTC held 14% of global NAND shipments in Q2 2026 and has started mass production of 267‑layer 3D NAND.
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YMTC and CXMT plan to expand overseas memory shipments. YMTC’s new Phase 3 fab will begin NAND and DRAM production late‑2026, ramping to 100,000 wafers per month, with LPDDR5 DRAM accounting for around 20% of output.
Beijing Qianxing Jietong Technology Co., Ltd.
Sandy Yang/Global Strategy Director
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